University of Lincoln - United Kingdom

University of Lincoln Scholarships 2016/17

The University of Lincoln has released a new set of scholarships for students in Malaysia for the coming 2016/17 cycle.

International Undergraduate Scholarships

Engineering Bursaries

Global industry leader Siemens offers a significant number of generous Bursaries to all full-time BEng and MEng Engineering applicants who make the University of Lincoln their first choice institution via UCAS.

Mathematics and Physics Scholarships

Available to all students who join an undergraduate programme in the School of Mathematics and Physics.

Science & Arts Scholarship

For self-funding international students with overseas fee status undertaking an Undergraduate laboratory and studio based course.

Academic Excellence Scholarship

For High achieving students from China, India, Malaysia, Norway, Nigeria, Saudi, Thailand, Vietnam and the United States. These scholarships are worth £5000 and are specific to certain courses depending on home country.

International Postgraduate Scholarships

Global Postgraduate Scholarships

For self-funding international (non-UK/EU) students with overseas fee status applying for postgraduate programmes.

International Alumni Scholarship

For self-funding international (non-UK/EU) students who have previously studied one of our undergraduate courses and progress onto one of our postgraduate courses.

Chevening Scholarships

For all international students who show outstanding leadership potential.

University of Lincoln Court Postgraduate Bursary

A one-off payment of £3,000 to an exceptional student embarking on a postgraduate taught (PGT) course within any discipline of the 2015/2016 academic year.

Commonwealth Scholarships

The University of Lincoln offers scholarships under the Commonwealth Scholarships Part-Funding Arrangement to qualifying Masters and PhD students.

For more information, please contact/visit your nearest JM Office today

                  

                                                                                                                                                                                           Article is courtesy of  University of Lincoln

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